Massive Transfer Technology
Ultra-high transfer yield, Wide chip compatibility range
- Self-developed MiniLED mass transfer technology, with a transfer yield of up to 99.99%
- Mega transfer line compatible chips 0204 (0.05*0.01mm)~0408 (0.1*0.2mm)
Laser Welding Technology
High laser welding efficiency, More accurate chip pressing
- Independently developed MiniLED mass welding technology equipment, the number of chips welded at one time Up to 7.2K
- Overall pressing laser welding, no tin paste process, chip position is correct, no chip tilting, sideways, deflection and other problems
- MiniCOBRework technology, achieving a yield of more than 99.99%l
Professional Packaging
Flip chip has high reliability, Waterproof, dustproof, anti-static and anti-scratch
- No gold wire welding to avoid gold wire collapse and dead light, high reliability, thinner glue layer and higher brightness
- Overall molded sealing to avoid chip exposure and electrode oxidation, waterproof, dustproof, anti-static and anti-scratch
- Overall lamp surface optical surface treatment, high ink color consistency, matte treatment, anti-glare
Exquisite Optical Technology
Adopt professional image quality engine, Excellent visual effect
- Ultra-high dynamic contrast ratio up to 2,000,000:1
- 3840Hz high refresh rate, 14~22Bit grayscale (using professional picture quality engine)
- NTSC color gamut area greater than 120%, support HDR function
